End-to-end product engineering
One team delivers the complete product — high-speed Linux board, enclosure, operating system, security, field updates, and production. You own all IP and can continue independently whenever you want.
High-speed Linux board design
Custom multi-layer PCBs around application processors — not constrained by SOM pinouts, form factors, or vendor roadmaps.
- SoC families NXP i.MX8M / i.MX93 / i.MX95, TI AM62x / AM64x, Rockchip RK35xx. Selected based on your performance, power, and lifecycle requirements.
- High-speed interfaces DDR3/DDR4/LPDDR4/LPDDR5, PCIe, GbE, USB 3.0, MIPI CSI/DSI, LVDS. Impedance-controlled layouts up to 12+ layers.
- Power architecture Custom PMIC configuration, sequencing, and thermal design. Optimized for your power budget and operating conditions.
- Rapid prototyping In-house 3D printing (FDM/SLA), CNC milling, and laser cutting for fast mechanical and electrical validation.
Enclosure & mechanical design
Board and housing are designed together from the start — thermal management, connectors, and assembly are part of the architecture, not an afterthought.
- CNC aluminum enclosures Precision machined housings with integrated heat sinks, connector cutouts, and mounting provisions.
- Injection-molded plastics For higher volumes. Designed with production in mind, material selection, and DFM review included.
- Thermal management Validation of heat paths in different environments. Passive and active cooling concepts matched to your operating conditions.
- IP rating & ruggedization Sealing, gasket design, and environmental protection for industrial and outdoor deployments.
Yocto Linux OS
A production-grade Linux distribution built for your hardware — not a patched dev-board image. Designed for long-term maintainability.
- BSP layer architecture Clean separation between machine, distro, and application layers. Documented upstream tracking strategy for kernel and u-boot.
- Build reproducibility Pinned revisions, CI-ready configurations, sstate cache setup. Any engineer can rebuild your image from source.
- Driver & device tree integration Custom peripherals, interfaces, and sensors integrated and validated. Boot-time optimization for your application.
- License compliance Automated SPDX/SBOM generation, license manifest review, and source archive creation for regulatory requirements.
Security & OTA updates
Security is an architectural decision, not a feature bolted on later. We build the boot chain, signing workflow, and update mechanism into the initial platform.
- Secure boot chain Hardware root of trust, signed bootloader stages, verified kernel and rootfs. Configured for your SoC's security features (HAB, OP-TEE).
- OTA update architecture A/B or differential updates with rollback. Integration-ready for SWUpdate, RAUC, Mender or our self hosted server — chosen based on your constraints.
- Image signing & key management Production signing workflow with key storage concept suitable for your security requirements.
- CVE monitoring posture Documented component inventory (SBOM) as basis for ongoing vulnerability tracking. Operable independently after handover.
Product compliance
We design for EMC, RED, and CE compliance from the schematic stage — and validate iteratively in our own lab before going to an external test house.
- In-house EMI lab Pre-compliance emissions and immunity testing during development. Iterate in days, not weeks.
- Design-for-compliance PCB layout, shielding, filtering, and grounding optimized for regulatory pass from the start.
- RED & CE marking Documentation, test coordination, and declaration of conformity preparation for European market access.
- External test house coordination We manage the certification process end-to-end — pre-testing reduces risk of costly re-tests.
Production & full IP handover
We produce the first series in-house and hand over everything — schematics, source, manufacturing data. You stay independent.
- In-house SMD assembly 1–1,000 PCBAs per month. Component sourcing, reflow, AOI inspection, and functional test on our own line.
- CNC & enclosure production Aluminum machining and plastic molding for complete finished units ready for deployment.
- Complete IP handover Schematics, layout, BOM, Gerbers, pick-and-place data, Yocto source, build scripts, test procedures. You can continue with any team or CM.
- Manufacturing transfer When volumes grow, we prepare the full data package for your chosen contract manufacturer. No lock-in.
Let's discuss your project
30 minutes. Your requirements, our assessment. No pitch deck.
Schedule a technical exchange